USP-10B03 packaging information reference pattern layout dimension note : reference metal mask design unit: mm packaging information / reference pattern layout dimensions 1pin indent 10 0.30.05 (0.65) (0.05) 0.40.05 (0.3) 1.250.05 0.20.05 (0.05) 1.00.05 1.00.05 2.50.05 2.150.05 (0.6) 87 5 6 4 3 12 9 (0.5) 0.90.05 (0.05) 0.250.05 0.3 0.325 0.35 1.05 0.35 0.325 0.35 0.4 0.2 1.25 0.2 0.4
USP-10B03 reel taping specifications taping specifications unit: mm 3,000pcs/reel 11.41.0 20.5 130.2 (1.5) 9.00.3 1.750.1 8.00.2 3.50.05 (2.8) direction of feed r type : standard feed
USP-10B03 power dissipation power dissipation data for the USP-10B03 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. condition: mount on a board ambient: natural convection soldering: lead (pb) free board dimensions: 40 x 40 mm (1600 mm 2 in one side) board structure: inner two metal layers, no large metal area in the front and back. copper area: 1st inner metal layer about 50% 2nd inner metal layer about 50% each heatsink back metal is connected to the inner layers respectively. material: glass epoxy (fr-4) thickness: 1.6 mm through-hole: 4 x 0.8 diameter 2. power dissipation vs. ambient temperature board mount ( tjmax=125 ) ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 500 85 200 200.00 pd-ta? 0 100 200 300 400 500 600 25 45 65 85 105 125 ??ta S?p?pdmw 1.4 40.0 40.0 2.5 28.9 28.9 pd vs. ta power dissipation pd mw a mbient tem p erature ta evaluation board (unit: mm)
USP-10B03 USP-10B03 perspective rohs ? rohs com p liance ? ? item material note ?? ?? y?` /flammability rating resin epoxy resin ul94v-0 `??? ?? lead pad nickel ?I au ? outer pad plating gold plating ? ? die attach epoxy ? U?`? solder pb-free solder ???? au bonding wire ?? si silicon chip ?? coil ?O coil-electrode ?? `` marking laser marking ni ?? + sn ? ceramic ni pre-plating + sn plating ver.01
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